Abrading – Precision device or process - or with condition responsive... – Computer controlled
Patent
1994-10-28
1997-05-27
Kisliuk, Bruce M.
Abrading
Precision device or process - or with condition responsive...
Computer controlled
451 10, 451 11, 451 56, 451443, 125 1302, 125 1104, 125 1118, B24B 5307
Patent
active
056326661
ABSTRACT:
An internal diameter saw, and in particular a method for operation which facilitates the maintenance of quality control of semiconductor wafers sliced from an ingot of source material. The internal diameter saw has a controller which monitors the deflection of the cutting edge of the blade at a location within the ingot as a wafer is sliced. Depending upon the deflection of the blade which is detected within the crystal, a blade dressing device is automatically activated to sharpen the blade following the cut.
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Mitsubishi Metal Corporation, "Guidance in the Usage of ID Blades", pp. 7, 8, 11-14 and 21, date unknown.
Toyo Advanced Technologies Co., Ltd., "CNC Slicing Machine" brochure, 4 pages, date unknown.
Toyo Advanced Technologies Co., Ltd., "Development of Fully-Automatic Slicing Machine", 9 pages, published prior to Oct. 28, 1993.
Mitsubishi Metal Corporation, MTD-0S (Mitsubishi Tracking Dressing Operation System)--Operation Guide, published prior to Oct. 28, 1993.
Meyer-Burger AG, "Meyer-Burger--A Step Ahead" brochure, 16 pages, date unknown.
Leoni Fabrizio
Peratello Andrea
Kisliuk Bruce M.
MEMC Electronic Materials , Inc.
Morgan Eileen P.
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