Metal fusion bonding – Including means to apply flux or filler to work or applicator – Solid flux or solid filler
Patent
1995-12-22
1998-07-21
Heinrich, Samuel M.
Metal fusion bonding
Including means to apply flux or filler to work or applicator
Solid flux or solid filler
2282481, 29879, 156556, H01L 2160
Patent
active
057823995
ABSTRACT:
The method is directed to attaching spherical and/or non-spherical contacts to a substrate having mounting pads arranged in a predetermined array. The method includes the steps of positioning the substrate over a fixture, and positioning a stencil over the substrate. The stencil has openings arranged in the predetermined array, and is held and aligned by the fixture in such a position that the openings of the stencil are aligned with the mounting pads of the substrate. Soldering paste is applied onto the stencil so as to fill the openings of the stencil wherein a dab of paste is left in the openings of the stencil. Next, a contact loading plate is positioned over the substrate, the plate having openings arranged in the predetermined array. The plate is held and aligned by the fixture in such a position that the openings of the plate are aligned with the mounting pads of the substrate. The openings of the contact loading plate are then filled with contacts. Next, the contact loading plate is removed from the substrate and fixture so as to leave the contacts on the dabs of paste provided on the mounting pads of the substrate. The substrate is then heated so as to solder the contacts to the mounting pads. An apparatus for achieving the method is further disclosed.
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Heinrich Samuel M.
TTI TesTron, Inc.
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