Method and apparatus for attaching balls to a substrate

Details Method and apparatus for attaching balls to a substrate Method and apparatus for attaching balls to a substrate

1996-04-26

1998-10-06

Heinrich, Samuel M.

Metal fusion bonding

Process

With clamping or holding

228 447, 269 8, 29879, 219616, B23K 3047, H01L 2160

Patent

active

058164820

ABSTRACT:
The present invention is directed to an apparatus and method for attaching balls to a substrate for forming a ball grid array. The apparatus consists of two pole pieces, a magnetizing coil, and an excitation coil. The first pole piece has an alignment plate having a plurality of openings, and a plurality of tips which can be magnetized by the magnetizing coil to attract a ball into each opening. Once the balls are attracted into the openings, excess balls are removed and the substrate is aligned with the balls such that each ball is in contact with a respective pad on the substrate. The first pole piece having the balls and substrate position thereon is then placed into a receiving area of the second piece. An excitation coil is excited with a high frequency signal to heat the balls and reflow solder that has been previously applied thereto. The assembly is then cooled and removed from the device and the ball grid array is complete.

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