Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
Patent
1997-12-19
2000-08-29
Zirker, Daniel
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
438459, 156321, C09J 506
Patent
active
061108057
ABSTRACT:
A method for attaching a workpiece, for example a semiconductor die, to a workpiece holder, for example a lead frame die support, comprises the steps of interposing an uncured adhesive between the semiconductor die and the die support and preheating the adhesive from an ambient temperature to a preheat temperature of between about 150.degree. C. and about 160.degree. C. over a period of about 1.5 seconds. Next, the preheat temperature is maintained for about 1.5 seconds, then the adhesive is further heated to a temperature of between about 190.degree. C. and about 200.degree. C. over a period of about 1.0 second. The inventive method quickly cures the adhesive to secure the die to the support with acceptably low levels of voiding. An apparatus which can be adapted to perform the inventive method is further described.
REFERENCES:
patent: 4998665 (1991-03-01), Hayashi
patent: 5475048 (1995-12-01), Jamison et al.
Quantum Materials--QMI505 Process Data Sheet, Jun. 1997.
Quantum Materials--Cure Kinetics for QMI 505 Data Sheet, not dated.
Johnson Matthey--JMXICM37 and JM2000LB Data Sheet, Jun. 1996.
Ablestick--RP224-1 Snap Cure Profile Data Sheet, Sep. 1996.
Jiang Tongbi
Schrock Ed
Micro)n Technology, Inc.
Zirker Daniel
LandOfFree
Method and apparatus for attaching a workpiece to a workpiece su does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus for attaching a workpiece to a workpiece su, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for attaching a workpiece to a workpiece su will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1249270