Method and apparatus for attaching a heat sink and a fan to an i

Details Method and apparatus for attaching a heat sink and a fan to an i Method and apparatus for attaching a heat sink and a fan to an i

1996-03-14

1997-01-14

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165 802, 165 803, 165185, 174 163, 257707, 361710, 361719, H05K 720

Patent

active

055946232

ABSTRACT:
An improved attachment method for attaching an heat sink to a integrated circuit package, which includes an heat spreader with a dove-tail feature attached to an upper surface of the integrated circuit package. The bottom surface of the heat sink has a dove-tail feature that matingly corresponds to the dove-tail feature of the heat spreader, such that the heat sink can be slide onto the heat spreader. The heat sink is prevented from sliding off of the heat spreader by a clip. A fan may be attached to the top surface of the heat sink using a clip that attaches to an outer edge of the heat sink or by making the outer two fins on the heat sink slightly taller than the fan with an inward dove-tail so that the fan can slide snugly between the top of the inner fins and the dove-tails of the outer two fins.

REFERENCES:
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patent: 5168926 (1992-12-01), Watson et al.
patent: 5309983 (1994-05-01), Bailey
patent: 5313099 (1994-05-01), Tata et al.
patent: 5335722 (1994-08-01), Wu
patent: 5353193 (1994-10-01), Chia et al.
Vestrout, "Dendritic Heat Sink" IBM Tech. Disclosure Bulletin, vol. 22, No. 2, Jul. 1979, p. 536 (165/80.3).
AAVID Engineering, Inc., "Thermal Management Solutions for Pin Grid Array (PGA) and Quad Flat Pack (QFP) Packages", pp. 1-2, no known date.
Thermalloy, Apr. 1993; "New Heat Sink Spring Clips for use with AMP* Low Insertion Force PGA Sockets", pp. 1-3.

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