Method and apparatus for assuring plating uniformity

Details Method and apparatus for assuring plating uniformity Method and apparatus for assuring plating uniformity

1987-07-02

1988-11-01

Tufariello, T. M.

Chemistry: electrical and wave energy

Apparatus

Electrolytic

C25D 1706

Patent

active

047818131

ABSTRACT:
A tensioning mechanism includes a frame pivotally carrying an arm at one end intermediate its length and carrying an arm fixed to the frame at its opposite end intermediate its length. Tension springs are disposed between the arms on one side of the frame and the ends of the arms on the opposite side of the frame releasably carry clamps for securing a substrate between the arms. When the substrate is clamped to the arms, the springs pivot the one arm to apply a tension to the substrate to ensure flatness and planarity of the substrate. The mechanism may then be disposed in an electrolytic bath for plating the substrate and hence defining locations for orifices to be formed in the substrate.

REFERENCES:
patent: 1427875 (1922-09-01), Weeks
patent: 2118957 (1938-05-01), Wagner
patent: 2762149 (1956-09-01), Mears
patent: 2891898 (1959-06-01), MacLean
patent: 2946584 (1960-07-01), Edwards
patent: 3677929 (1972-07-01), Young, Jr.
patent: 4395613 (1983-07-01), Barr et al.
patent: 4609249 (1986-09-01), Hornack et al.
"Wafer Chuck," Brunner, IBM Technical Disclosure Bulletin, vol. 17, No. 1, p. 84, Jun., 1974.

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