Method and apparatus for assessing and restoring solderability

Chemistry: electrical and wave energy – Processes and products – Processes of treating materials by wave energy

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

204400, 204412, 204434, G01N 2726

Patent

active

054258596

ABSTRACT:
A sequential electrochemical reduction method and apparatus are provided for assessing and restoring solderability of electronic component leads. The method detects and quantifies the presence of metallic oxides that are detrimental to solderability by sequential electrochemical reduction in contact with an electrolyte in an inert atmosphere. A cathode having a high hydrogen overvoltage is placed in contact with the electrolyte. A solderable portion of the component to be tested is placed in contact with the cathode and the electrolyte. An inert counter electrode and a reference electrode are also placed in contact with the electrolyte. A current is passed between the cathode and inert electrode, and the voltage and current are measured as a function of time during reduction of metallic oxides on the solderable portions of the component. The measurements of voltage, current, time, and charge density may be compared with baseline data from specimens having known oxide compositions that correlate with degradation of solderability.

REFERENCES:
patent: 2390591 (1945-12-01), Janes
patent: 3032493 (1962-05-01), Coulson et al.
patent: 3102085 (1963-08-01), Edwards et al.
patent: 3309233 (1967-03-01), McPheeters et al.
patent: 3421989 (1969-01-01), Haagen-Smit
patent: 3684679 (1972-08-01), Smith et al.
patent: 3838021 (1974-09-01), Arbiter
patent: 3943043 (1976-03-01), Billington et al.
patent: 4132605 (1979-01-01), Tench et al.
patent: 4427496 (1984-01-01), Katz
patent: 4654126 (1987-03-01), Amelio
patent: 4718990 (1988-01-01), Hashimoto et al.
patent: 4725339 (1988-02-01), Bindra et al.
patent: 5104494 (1992-04-01), Tench et al.
Kolthoff et al, Polarography, 2d. ed., vol. 1, (1952), p. 395.
Tench et al., "Electrochemical Assessment of Sn-Pb Solderability," Plating and Surface Finishing, pp. 44-46, Aug. 1990.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method and apparatus for assessing and restoring solderability does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for assessing and restoring solderability, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for assessing and restoring solderability will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1842356

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.