Method and apparatus for assembling parts

Details Method and apparatus for assembling parts Method and apparatus for assembling parts

2004-02-04

2008-09-23

Goff, John L (Department: 1791)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S085000, C156S275700, C347S040000

Reexamination Certificate

active

07427332

ABSTRACT:
A method and an apparatus for fixing a part and a part support for mounting the part by use of adhesive via an intermediate member are disclosed. The adhesive is implemented by photocuring adhesive while the intermediate member is formed of a material transparent for light. The intermediate member is free from coloring and deformation when illuminated by light for curing the adhesive. The adhesive is prevented from dropping or turning round to other portions during assembly.

REFERENCES:
patent: 5154791 (1992-10-01), Gasser et al.
patent: 5361168 (1994-11-01), Arai et al.
patent: 5785793 (1998-07-01), Arai et al.
patent: 5840147 (1998-11-01), Grimm
patent: 5904795 (1999-05-01), Murakami et al.
patent: 6217684 (2001-04-01), Morii et al.
patent: 6435241 (2002-08-01), Morii et al.
patent: 6471801 (2002-10-01), Takemoto et al.
patent: 6503358 (2003-01-01), Takemoto et al.
patent: 6544376 (2003-04-01), Takemoto et al.
patent: 6627015 (2003-09-01), Takemoto et al.
patent: 6726806 (2004-04-01), Takemoto et al.
patent: 58049636 (1983-03-01), None
Abstract for JP 58049636.

Affiliated with

Also associated with

Rating

Method and apparatus for assembling parts does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for assembling parts, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for assembling parts will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3966225