Metal fusion bonding – With means to juxtapose and bond plural workpieces – Plural discrete workpieces
Patent
1995-06-07
1996-10-15
Bradley, P. Austin
Metal fusion bonding
With means to juxtapose and bond plural workpieces
Plural discrete workpieces
228 33, 22818022, B23K 306
Patent
active
055646174
ABSTRACT:
A multichip module is assembled using flip-chip bonding technology, a stencil printable solder paste and standard surface mount equipment for interconnecting signaling input/output contact pads on devices within such a multichip module. The disclosed assembly process makes the heretofore difficult and expensive flip chip bonding technique achievable at low cost. The flip chip bonding technique is simplified by use of a solder paste which includes desirable reflow alignment, fluxing and printability characteristics. These desirable characteristics allow the assembly process to be further economically achieved by permitting the use of standard surface mount equipment in the process. High volume production of standard inexpensive modules are thus possible through this process while also achieving the advantage of high density interconnections afforded through the flip-chip bonding technology.
REFERENCES:
patent: 4509994 (1985-04-01), Barajas
patent: 5150832 (1992-09-01), DeGani et al.
patent: 5176759 (1993-01-01), Taguchi
patent: 5197655 (1993-03-01), Leerson et al.
patent: 5346118 (1994-09-01), DeGani et al.
Degani Yinon
Dudderar Thomas D.
Tai King L.
Bradley P. Austin
Knapp Jeffrey T.
Lucent Technologies - Inc.
Williamson Samuel R.
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