Method and apparatus for assembling multi-core dice using...

Details Method and apparatus for assembling multi-core dice using... Method and apparatus for assembling multi-core dice using...

2006-03-20

2009-10-13

Dinh, Tuan T (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S780000, C439S067000

Reexamination Certificate

active

07602616

ABSTRACT:
An embodiment of the present invention is a technique to assemble multi-core dice. A first socket has first N sets of front side bus (FSB) contacts to house a first package having first 2N dice. Each of the first 2N dice has M cores. N and M are positive integers. A first chipset has 2N FSB signal groups interfacing to the first package via the first N sets of FSB contacts using first N FSB signal groups of the 2N FSB signal groups.

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patent: 2003/0057980 (2003-03-01), Murphy et al.
patent: 2004/0102074 (2004-05-01), Kukita et al.
patent: 2007/0156971 (2007-07-01), Sistla et al.
Wikipedia, “Socket T”, http://en.wikipedia.org/wiki/Socket—T.

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