Method and apparatus for assembling electronics

Details Method and apparatus for assembling electronics Method and apparatus for assembling electronics

2005-08-09

2005-08-09

Trinh, Minh (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S834000, C029S740000, C029S759000

Reexamination Certificate

active

06925709

ABSTRACT:
An apparatus for assembling electronics is provided, comprising a support frame, at least one pick-and-place mechanism, at least one device-engaging component, a feed device, and a programmer or tester. The pick-and-place mechanism is secured to the support frame. The device-engaging component is secured to the pick-and-place mechanism. The feed device has a slender body secured to the frame to feed a plurality of electronic devices to a feed location. The programmer or tester has a slender body secured to the support frame in a side-by-side relationship relative to the feed device. The programmer or tester has a socket located at an intermediate location. The devices are movable by the device-engaging component from the feed location to the socket at the intermediate location.

REFERENCES:
patent: 5379514 (1995-01-01), Okuda et al.
patent: 5400497 (1995-03-01), Watanabe et al.
patent: 5456001 (1995-10-01), Mori et al.
patent: 5649356 (1997-07-01), Gieskes
patent: 5979045 (1999-11-01), Nishimori et al.
patent: 6176011 (2001-01-01), Shirakawa
patent: 6591486 (2003-07-01), Bolotin

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