Semiconductor device manufacturing: process – With measuring or testing – Packaging or treatment of packaged semiconductor
Patent
1996-01-26
1998-04-14
Picardat, Kevin
Semiconductor device manufacturing: process
With measuring or testing
Packaging or treatment of packaged semiconductor
438 14, H01R 4300
Patent
active
057390509
ABSTRACT:
A method and apparatus for assembling a temporary package for a semiconductor die are provided. The temporary package includes a package base, an interconnect for establishing electrical communication with the die, and a force applying mechanism for biasing the die against the interconnect. The method includes the steps of: supporting the package base; aligning the die with the interconnect held in the package base; placing the die and interconnect in contact; and then attaching the force applying mechanism to the base while it is allowed to slide along a plane parallel to the base to compensate for misalignment. The apparatus includes a movable support for the package base; an optical probe for aligning the die and interconnect; a vacuum conduit for placing the die in contact with the interconnect; and a slide holder for attaching the force applying mechanism to the base.
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Gratton Stephen A.
Micro)n Technology, Inc.
Picardat Kevin
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