Surgery – Instruments – Orthopedic instrumentation
Reexamination Certificate
2004-03-29
2010-12-07
Barrett, Thomas C (Department: 3775)
Surgery
Instruments
Orthopedic instrumentation
C606S079000
Reexamination Certificate
active
07846165
ABSTRACT:
A guide system for resecting a bone through incisions of the type utilized for arthroscopic procedures is provided. The guide system comprises a first alignment pin, a second alignment pin and a wire saw. The first alignment pin is configured to be inserted through a first incision into a bone in a first orientation. The second alignment pin is configured to inserted through a second incision into the bone in a second orientation. The first alignment pin and the second alignment pin are configured and oriented to define a resection plane of reference through which the bone is to be resected and the wire saw is configured to be inserted through the first and second incisions to be guided by the first and second alignment pins while being moved to resect the bone.
REFERENCES:
patent: 4421112 (1983-12-01), Mains et al.
patent: 4759350 (1988-07-01), Dunn et al.
patent: 5060628 (1991-10-01), Ishida
patent: 5077902 (1992-01-01), Hitt
patent: 5246444 (1993-09-01), Schreiber et al.
patent: 5505738 (1996-04-01), Hempel et al.
patent: 5817097 (1998-10-01), Howard et al.
patent: 5851209 (1998-12-01), Kummer et al.
patent: 5911724 (1999-06-01), Wehrli
patent: 2004/0143280 (2004-07-01), Suddaby
patent: 2005/0070909 (2005-03-01), Egger et al.
patent: 2006/0030854 (2006-02-01), Haines
Aram Luke
Auger Dan
Hayden Adam
Araj Michael J
Barrett Thomas C
DePuy Products, Inc.
Maginot Moore & Beck
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