Metal fusion bonding – Process – Plural joints
Patent
1983-03-31
1985-07-09
Godici, Nicholas P.
Metal fusion bonding
Process
Plural joints
228 37, 228 39, 228 43, 228215, B23K 3102
Patent
active
045277311
ABSTRACT:
Pressurized molten solder 71 is flowed along a confined first channel 86 and forced through a series of spaced, aligned apertures 88 as solder jets which rise, fall and merge to form a solder stream which flows along a second channel defined by channel walls 93 and 94. Spring held printed circuit boards 10 are advanced by a conveyor 21 which is tilted to move a far section of each board into engagement with the top of channel wall 93 and then a near section of each board into engagement with the top of channel wall 94 whereafter the board is spring held to ride along the tops of channel walls while a thin stripe of solder is applied to the board.
REFERENCES:
patent: 3039185 (1962-06-01), Oates
patent: 3151592 (1964-10-01), Wegener
patent: 3277566 (1966-10-01), Christensen
patent: 3363819 (1968-01-01), Gerlitz
patent: 3604611 (1971-09-01), Lamberty
patent: 3616984 (1971-11-01), Voroba
patent: 3726465 (1973-04-01), Boynton et al.
patent: 3765591 (1973-10-01), Cook
patent: 3767102 (1973-10-01), Parsons
patent: 4447001 (1984-05-01), Allen et al.
Kent William C.
Payne Charles H.
AT&T - Technologies, Inc.
de Picciotto M.
Godici Nicholas P.
Miller R. P.
Weikert Maureen
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