Method and apparatus for applying solder masking to a circuit bo

Details Method and apparatus for applying solder masking to a circuit bo Method and apparatus for applying solder masking to a circuit bo

1983-12-23

1985-12-24

Smith, John D.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

228118, 427259, 427421, 427424, H05K 328

Patent

active

045605840

ABSTRACT:
In accordance with one embodiment of the invention, solder masking material is pressurized by means of a fluid pump to approximately 250 psi and a high speed valve is used to turn the flow on and off rapidly in order that small "shots" of fluid are propelled from a tip, through the air, to selected portions of a circuit board. The selected areas of the circuit board to be masked are situated oppositely from the tip, as by a XY positioning system for the tip and/or the circuit board. The drops of masking material, which form upon impinging of the shots onto the circuit board, may be varied in volume and diameter. Where needed, a continuous bead of masking material may be formed on the circuit board by spacing the dots sufficiently close together.

REFERENCES:
patent: 3298030 (1967-01-01), Lewis
patent: 4070506 (1978-01-01), Meister
patent: 4296418 (1981-10-01), Yamazaki et al.
patent: 4301189 (1981-11-01), Arai et al.
patent: 4367479 (1983-01-01), Bower

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