Method and apparatus for applying solder flux to a printed circu

Details Method and apparatus for applying solder flux to a printed circu Method and apparatus for applying solder flux to a printed circu

1994-08-08

1995-05-16

Heinrich, Samuel M.

Metal fusion bonding

Process

With protecting of work or filler or applying flux

228102, 427 96, B05B 1500, B05B 1502, B23K 120

Patent

active

054153379

ABSTRACT:
Apparatus and methods for a system and process for applying a flux coating to a circuit board by pulsing an airless spray gun on and off to achieve excellent circuit board through-hole penetration and uniform film thickness. An overspray collection system is provided which reduces overspray and increases material utilization and transfer efficiency. A gun positioning mechanism, which can be automated, accurately locates the gun relative to the circuit board.

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