Method and apparatus for applying solder flux to a printed circu

Details Method and apparatus for applying solder flux to a printed circu Method and apparatus for applying solder flux to a printed circu

1993-11-04

1994-11-29

Heinrich, Samuel M.

Metal fusion bonding

Including means to apply flux or filler to work or applicator

228 43, 228 10, 118324, 118326, B05B 1500, B05B 1502

Patent

active

053682190

ABSTRACT:
Apparatus and methods for a system and process for applying a flux coating to a circuit board by pulsing an airless spray gun on and off to achieve excellent circuit board through-hole penetration and uniform film thickness. An overspray collection system is provided which reduces overspray and increases material utilization and transfer efficiency. A gun positioning mechanism, which can be automated, accurately locates the gun relative to the circuit board.

REFERENCES:
patent: 3741150 (1973-06-01), Napor et al.
patent: 3916032 (1975-10-01), Conner
patent: 4560584 (1985-12-01), Henninger
patent: 4821948 (1989-04-01), Fisher et al.
patent: 4828887 (1989-05-01), Toutant et al.
patent: 5017409 (1991-05-01), Bok
patent: 5065692 (1991-11-01), Hollesen et al.

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