Method and apparatus for applying metal cladding on surfaces and

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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427 541, 427204, 427290, 427423, B05D 108, B05D 306

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active

046185046

ABSTRACT:
Small, preferably micronsized hollow glass or ceramic spheres or foaming agents for making such micronsized hollow spaces or voids are incorporated into a resin material which is formed into a layer and after curing of the resin layer, it is abraded, sand or grit blasted so as to rupture the outermost layer of spheres or voids to provide a plurality of undercuts or nooks and crannies. A thermally sprayed metal, such as copper, becomes embedded into the undercuts pores, nooks and crannies, such that the bond or adherent strength is greatly improved. This micronsized glass, ceramic spheres and/or pores greatly increases the bond strength by providing better undercuts in the surface to be sprayed by molten metal and provide the capability of depositing thicker layers without jeopardizing the bond.

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