Metal fusion bonding – Process – With protecting of work or filler or applying flux
Patent
1988-04-06
1989-04-18
Godici, Nicholas P.
Metal fusion bonding
Process
With protecting of work or filler or applying flux
228 33, 228 43, 2281801, B23K 120
Patent
active
048219487
ABSTRACT:
A controlled amount of flux is applied to a circuit board (10) by first directing liquid flux through a nozzle (54) containing means for disintegrating the flux into a very fine fog of tiny flux droplets (62). The fog of flux droplets is injected into a laminar gas stream (52), thereby creating a laminar flux stream which is directed at the circuit board to coat the board with flux. As the flux spray is being directed at the circuit board, the concentration of flux solids on the board is being regulated, typically by controlling the rate of flux pumped into the nozzle.
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Fisher John R.
Guth Leslie A.
Mahler James A.
American Telephone and Telegraph Company
Godici Nicholas P.
Levy Robert B.
Starkweather Michael William
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