Method and apparatus for applying flux to a substrate

Details Method and apparatus for applying flux to a substrate Method and apparatus for applying flux to a substrate

1989-02-01

1989-10-03

Godici, Nicholas P.

Metal fusion bonding

Including means to apply flux or filler to work or applicator

228 43, 228 37, 239 61, 239 71, 239403, 239468, H05K 334

Patent

active

048711055

ABSTRACT:
A controlled amount of flux is applied to a circuit board (10) by first directing liquid flux through a nozzle (54) containing means for disintegrating the flux into a very fine fog of tiny flux droplets (62). The fog of flux droplets is injected into a laminar gas stream (52), thereby creating a laminar flux stream which is directed at the circuit board to coat the board with flux. As the flux spray is being directed at the circuit board, the concentration of flux solids on the board is being regulated, typically by controlling the rate of flux pumped into the nozzle.

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