Metal fusion bonding – Process – With protecting of work or filler or applying flux
Patent
1995-03-02
1997-04-01
Warden, Jill
Metal fusion bonding
Process
With protecting of work or filler or applying flux
118 74, 118313, 118669, 118710, 228 33, 427286, 427421, 427 96, B23K 3700
Patent
active
056158289
ABSTRACT:
A dispensing apparatus for applying a pulsed thin stream of flux to a surface such as a printed circuit board. The stream of flux is pulsed at a high rate to apply a thin layer of flux on the surface. The dispensing head consists of multiple orifices for applying the flux to the board. The streams of flux are angularly disposed and a pan is positioned for capturing flux which passes by the board. The board is conveyed by the dispensing head. Controls are incorporated for board sensing and identification, application width selection, precise pressure control, fluid flow monitoring and system safety conditions.
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Ludlow Jan M.
Precision Dispensing Equipment, Inc.
Warden Jill
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