Metal fusion bonding – Process – Plural joints
Patent
1987-05-18
1988-07-26
Godici, Nicholas P.
Metal fusion bonding
Process
Plural joints
228 561, 228256, 228259, 228119, 228191, 118225, 118255, 427282, B23K 120, B23K 300, B23K 3102
Patent
active
047594918
ABSTRACT:
A controlled amount of a solder is applied to the tip (18) of each lead (14) of a multi-lead component (10) by first placing a solder sphere (30) in each of a plurality of cavities (24) arranged in a baseplate (22) in the same pattern as the tips of the leads. Thereafter, the tips of the leads of the component are placed in contact with the solder spheres while, at the same time, at least a pair of leads are each engaged by a separate one of a pair of alignment pins (32) rising upwardly from the baseplate. The alignment pins serve to constrain the lateral movement of the component, thereby maintaining the leads thereof in alignment with the solder spheres when the solder spheres are reflowed to bond to the tips of the leads.
REFERENCES:
patent: 4396140 (1983-08-01), Jaffe et al.
patent: 4439918 (1984-04-01), Carroll et al.
patent: 4638938 (1987-01-01), Yarne et al.
patent: 4646435 (1987-03-01), Grassauer
patent: 4657172 (1987-04-01), Lee
J. Lyman, "Sized Solder Bumps Make Solid Joints", Electronics, pp. 46, 48, Nov. 3, 1981.
W. O. Druschel and C. G. Metreaud, IBM Technical Disclosure Bulletin, vol. 21, Nov. 1978.
American Telephone and Telegraph Company
Godici Nicholas P.
Heinrich Samuel M.
Levy Robert B.
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