Coating apparatus – Solid applicator contacting work – With work-handling or work-supporting
Patent
1989-08-16
1992-01-07
Wityshyn, Michael
Coating apparatus
Solid applicator contacting work
With work-handling or work-supporting
118406, B05C 502
Patent
active
050780824
ABSTRACT:
A method and apparatus are provided for applying a bonding material such as solder paste or conductive epoxy to a printed circuit board or other substrate surface upon which one or more other electrical components may already have been premounted. An exemplary embodiment of the invention includes a removable fixture having a screening surface which is generally shaped to conform to the area targeted on the circuit board and which contains holes prepositioned to correspond to electrical contacts of the electrical component to be mounted. The screening surface is connected to a holding frame by at least two vertical sides to allow easy placement of the screening surface on a populated or empty circuit board and to protect other mounted electrical components from damage or displacement during the screening process. The screening surface is placed on the targeted area of the circuit board, and solder is pushed across the screening surface by a squeegee and thereby coerced through the prepositioned holes and deposited onto the circuit board.
REFERENCES:
patent: 3919973 (1975-11-01), Zimmer
patent: 4693209 (1987-09-01), Leicht
patent: 4784310 (1988-11-01), Metzger et al.
SMT East Corporation
Wityshyn Michael
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