Method and apparatus for applying body bias to integrated...

Details Method and apparatus for applying body bias to integrated... Method and apparatus for applying body bias to integrated...

2006-07-11

2006-07-11

Tran, Thien F. (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S717000, C257S719000, C257S778000

Reexamination Certificate

active

07075180

ABSTRACT:
In some embodiments, a method includes providing an integrated circuit (IC) die in a package. The IC die may have a metal layer on a back surface of the IC die. The method may also include applying a bias signal to the IC die via the metal layer.

REFERENCES:
patent: 5287247 (1994-02-01), Smits et al.

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