Method and apparatus for applying atomized adhesive to a leadfra

Details Method and apparatus for applying atomized adhesive to a leadfra Method and apparatus for applying atomized adhesive to a leadfra

1998-02-24

2000-02-29

Jones, Deborah

Stock material or miscellaneous articles

Composite

Of metal

428333, 174259, 257709, 257724, 257725, B32B 1508

Patent

active

060307110

ABSTRACT:
An apparatus and method for evenly applying an atomized adhesive for bonding a die to a leadframe are disclosed. In one embodiment, the apparatus includes a hood in communication with an air supply and a vacuum plenum that encompass a semiconductor device component located in a target area during adhesive application so that the adhesive is selectively applied to specific portions of the leadframe or other semiconductor device component and adhesive is not allowed outside the system. A mask or stencil may be employed for further prevention of adhesive application to undesired areas. An air purge may be employed to direct the adhesive mist toward the component to be coated. In another embodiment, a fine adhesive spray is directed against the surface of the workpiece to be coated, selected areas being masked to prevent coating. Wafers may be coated as well as leadframes.

REFERENCES:
patent: 2338650 (1944-01-01), Lowenthal
patent: 3280019 (1966-10-01), Harding et al.
patent: 4019458 (1977-04-01), Kolterer
patent: 4375383 (1983-03-01), Sewell et al.
patent: 4595446 (1986-06-01), Newkirk et al.
patent: 4720740 (1988-01-01), Clements et al.
patent: 4729809 (1988-03-01), Dery et al.
patent: 5024867 (1991-06-01), Iwabuchi
patent: 5057456 (1991-10-01), Dehaine
patent: 5066522 (1991-11-01), Cole et al.
patent: 5073517 (1991-12-01), Iwabuchi et al.
patent: 5076485 (1991-12-01), MacKay
patent: 5094976 (1992-03-01), Iwabuchi et al.
patent: 5187123 (1993-02-01), Yoshida et al.
patent: 5221642 (1993-06-01), Burns
patent: 5225966 (1993-07-01), Basavanhally et al.
patent: 5258577 (1993-11-01), Clements
patent: 5258647 (1993-11-01), Wojnarowski et al.
patent: 5286679 (1994-02-01), Farnworth et al.
patent: 5304842 (1994-04-01), Farnworth et al.
patent: 5306345 (1994-04-01), Pellet et al.
patent: 5308648 (1994-05-01), Prince et al.
patent: 5373110 (1994-12-01), Inasaka
patent: 5423889 (1995-06-01), Colquitt et al.
patent: 5444923 (1995-08-01), Romm et al.
patent: 5448450 (1995-09-01), Burns
patent: 5459335 (1995-10-01), Matsushita et al.
patent: 5463190 (1995-10-01), Carson et al.
patent: 5464154 (1995-11-01), Nielsen
patent: 5500785 (1996-03-01), Funada
patent: 5579573 (1996-12-01), Baker et al.
patent: 5622896 (1997-04-01), Knotter et al.
patent: 5688584 (1997-11-01), Casson et al.
patent: 5759874 (1998-06-01), Okawa
patent: 5874322 (1999-02-01), Evers

Affiliated with

Also associated with

Rating

Method and apparatus for applying atomized adhesive to a leadfra does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for applying atomized adhesive to a leadfra, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for applying atomized adhesive to a leadfra will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-680883