Method and apparatus for applying an electronic component adhesi

Details Method and apparatus for applying an electronic component adhesi Method and apparatus for applying an electronic component adhesi

1997-03-26

1999-03-16

Engel, James

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156356, 156578, 118697, 118712, 427 8, B05C 1100

Patent

active

058824510

ABSTRACT:
A method and apparatus for applying an electronic component adhesive with a minimum length of time for setting a proper application condition. Variation of application shapes of each type of the adhesive is monitored under various different application conditions and its resultant data is saved. When a desired application shape is inputted, the application nozzles are automatically controlled to apply desired doses of the adhesive under an optimum application condition which is defined by retrieving the data previously stored. Also, various different application shapes for bonding respective electronic components may be determined and saved in advance, so that a proper application condition can be automatically determined by retrieving the data on the application shapes when a desired electronic component is selected.

REFERENCES:
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patent: 5292368 (1994-03-01), Komine et al.
patent: 5336357 (1994-08-01), Layher et al.
patent: 5437727 (1995-08-01), Yoneda et al.

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