Method and apparatus for applying a wafer to a mount plate

Details Method and apparatus for applying a wafer to a mount plate Method and apparatus for applying a wafer to a mount plate

1994-12-20

1997-02-11

Picardat, Kevin

Fishing, trapping, and vermin destroying

437211, 437214, 437217, H01L 460

Patent

active

056020589

ABSTRACT:
A method and apparatus are provided for applying a wafer to a mount plate. A wafer having a lower surface coated with an adhesive layer is held by a vacuum chuck through suction. A vacuum-tight sealing enclosure is placed over the wafer and a mount plate to define a sealed space. The sealed space is then evacuated at a degree of vacuum higher than the degree of vacuum of the vacuum chuck to effect release of the wafer from the vacuum chuck and dropping of the wafer onto the mount plate. The wafer is applied to the mount plate without the occlusion of air bubbles between the wafer and the mount plate.

REFERENCES:
patent: 5037262 (1991-08-01), Moll et al.
patent: 5105255 (1992-04-01), Shannon et al.
patent: 5273615 (1993-12-01), Asetta et al.
patent: 5303938 (1994-04-01), Miller et al.
patent: 5324381 (1994-06-01), Nishiguchi
patent: 5410791 (1995-05-01), Wirth et al.

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