Method and apparatus for applying a compound of a metal and a ga

Details Method and apparatus for applying a compound of a metal and a ga Method and apparatus for applying a compound of a metal and a ga

1991-08-08

1993-03-23

Weisstuch, Aaron

Coating processes

Direct application of electrical, magnetic, wave, or...

Ion plating or implantation

118723, 20429805, 20429807, 427576, C23C 1432

Patent

active

051961024

ABSTRACT:
A method of applying a compound of a metal and a reactive gas onto a surface by depositing a metal from a liquid metal cluster ion source onto said surface in the presence of a gas on the surface to combine with the deposited metal while isolating the gas from the source of the metal cluster ions.

REFERENCES:
patent: 4088926 (1978-05-01), Fletcher et al.
patent: 4572842 (1986-02-01), Dietrich et al.
patent: 4710283 (1987-12-01), Singh et al.
patent: 4805555 (1989-02-01), Itoh
patent: 5110435 (1992-05-01), Haberland
U.S. Ser. No. 07/653,609 entitled "Method of Making Bonding Bumps" filed Feb. 11, 1991.
C. D'Cruz and K. Pourrezaei, "Ion Cluster Emission and Deposition from Liquid Gold Ion Sources," Journal of Applied Physics, vol. 58(7) Oct. 1, 1985, pp. 2427-2430.

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