Method and apparatus for application of adhesive tape to semicon

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Indefinite or running length flexible strand – rod – tube – or...

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156521, 156517, B32B 3100

Patent

active

060961651

ABSTRACT:
A first adhesively coated tape material length is supplied to a first die associated with a cutting and application mechanism. A second length of adhesively coated tape material is also provided to a second die of the cutting and application mechanism. A plurality of LOC leadframes is supplied sequentially through the application structure to apply a first decal cut from the first tape material to a first die site at a first location and to apply a second decal cut from the second tape material to a second die site at a second location.

REFERENCES:
patent: 2157735 (1939-05-01), Brite
patent: 3177629 (1965-04-01), Anspach
patent: 3308000 (1967-03-01), Holman
patent: 3332818 (1967-07-01), MacLeod
patent: 3436294 (1969-04-01), Marano
patent: 3536550 (1970-10-01), Von Hofe
patent: 4317695 (1982-03-01), Asar Madhu P. et al.
patent: 4539058 (1985-09-01), Burgess et al.
patent: 4862245 (1989-08-01), Pashby et al.
patent: 5286679 (1994-02-01), Farnworth et al.
patent: 5304842 (1994-04-01), Farnworth et al.

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