Method and apparatus for application of adhesive

Details Method and apparatus for application of adhesive Method and apparatus for application of adhesive

1998-07-10

1999-08-17

Osele, Mark A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156356, 156357, 156378, 118315, 118323, 118702, 427 8, B32B 3100, B05B 706, B05D 314

Patent

active

059388714

ABSTRACT:
An application method of adhesive for applying an adhesive by an application nozzle on an application object. Each application object is positioned in a direction intersecting the conveying direction by the move of each tables and the individual application heads corresponding to the tables are individually moved and positioned in the conveying direction, and the adhesive is applied simultaneously to necessary positions of the application objects by the application heads, so that the production efficiency of electronic circuit boards is enhanced in various aspects without increasing the size of the apparatus.

REFERENCES:
patent: 3715258 (1973-02-01), Cunnane
patent: 4010203 (1977-03-01), Aylon
patent: 4170883 (1979-10-01), Varner
patent: 4458628 (1984-07-01), Fujii et al.
patent: 4564410 (1986-01-01), Clitheros et al.
patent: 4872417 (1989-10-01), Kuwabara et al.
patent: 5110615 (1992-05-01), Maiorca et al.
patent: 5292368 (1994-03-01), Komine et al.
patent: 5336357 (1994-08-01), Layher et al.
patent: 5437727 (1995-08-01), Yoneda et al.

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