Method and apparatus for an integrated circuit chip carrier havi

Details Method and apparatus for an integrated circuit chip carrier havi Method and apparatus for an integrated circuit chip carrier havi

1994-08-10

1997-04-29

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257786, 257723, H01L 2304

Patent

active

056252242

ABSTRACT:
An integrated circuit chip carrier (100) provides an improved mounting pad density. The chip carrier (100) includes a flexible substrate (102) with pads (104) on the top surface for interconnection with an attached integrated circuit chip (302). The chip carrier (100) further includes a mounting pad array (502) on the bottom surface having an interconnection with the pads (104), and a rigid substrate (202) having an array of holes (204) extending through it. The top surface of the rigid substrate (202) is fixedly attached to the bottom surface of the flexible substrate (102). Individual holes of the array of holes (204) correspond to and align with individual pads of the mounting pad array (502). The chip carrier (100) further includes solder (206) disposed on the mounting pad array (502) and extending through the array of holes (204) beyond the bottom surface of the rigid substrate (202) for mounting the integrated circuit chip carrier (100) to a circuit bearing substrate (700).

REFERENCES:
patent: 5089881 (1992-02-01), Panicker
patent: 5134462 (1992-07-01), Freyman et al.
patent: 5241133 (1993-08-01), Mullen, III et al.
patent: 5293067 (1994-03-01), Thompson et al.
patent: 5450290 (1995-09-01), Boyko et al.
patent: 5479319 (1995-12-01), Werther
patent: 5481435 (1996-01-01), Werther
patent: 5481436 (1996-01-01), Werther
patent: 5513076 (1996-04-01), Werther

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