Method and apparatus for alignment of submicron lithographic fea

Details Method and apparatus for alignment of submicron lithographic fea Method and apparatus for alignment of submicron lithographic fea

1990-10-19

1994-08-30

Turner, Samuel A.

Optics: measuring and testing

By polarized light examination

With birefringent element

356356, 356401, G01B 902

Patent

active

053432924

ABSTRACT:
In the manufacture of microelectronic and optoelectronic circuitry, an arrangement for aligning submicrometer lithographic features on a wafer illuminating a diffraction grating on the wafer with an interferometrically established radiation intensity pattern having a predetermined relationship to the lithographic features in another level of the wafer that is to be exposed, the radiation diffracted from the illuminated grating forming moire interference pattern providing spatial amplification of the grating period for alignment purposes by the ratio of the moire fringe spacing to the grating period.

REFERENCES:
patent: 4332473 (1982-06-01), Ono
patent: 4545683 (1985-10-01), Markle
patent: 4631416 (1986-12-01), Trutna
patent: 4710026 (1987-12-01), Magome et al.
patent: 5100237 (1992-03-01), Wittekoek et al.
Durande, A., et al., "Measure de la Temperature de Surface d'un Echantillon au Cours d'un Traitement par Plasma"; CNRS-CIT Alcatel, CNRS UA 884.
van den Brink, M. A., et al., "Performance of a Wafer stepper with automatic intra-die registration correction", SPIE vol. 772, Optical Microlithography VI (1987).
Weissman, Eric M., "Moire interferometry near the the theoretical limit", May 1, 1982, vol. 21, No. 9, Applied Optics.

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