Method and apparatus for alignment of a wafer

Details Method and apparatus for alignment of a wafer Method and apparatus for alignment of a wafer

1998-06-12

2000-03-14

Font, Frank G.

Optics: measuring and testing

By alignment in lateral direction

G01B 1100

Patent

active

060380292

ABSTRACT:
A semiconductor production tool which provides alignment of a wafer at a fab station thereof includes an optical system, a wafer translation mechanism, a field of view translation unit and a unit for determining alignment. The optical system has a field of view which views the wafer. The wafer translation mechanism at least brings the wafer to a predetermined measurement location. In the present invention, the field of view translation unit translates the field of view relative to the wafer so as to view at least a portion of an edge of the wafer during an alignment operation. The unit for determining alignment is operative during the alignment operation and determines the alignment of the wafer from images produced by the optical system when the optical system views at least a portion of the marker.

REFERENCES:
patent: 4308586 (1981-12-01), Coates
patent: 4328553 (1982-05-01), Fredriksen et al.
patent: 4475122 (1984-10-01), Green
patent: 4516855 (1985-05-01), Korth
patent: 4555767 (1985-11-01), Case et al.
patent: 4585348 (1986-04-01), Chastang et al.
patent: 4618262 (1986-10-01), Maydan et al.
patent: 4647207 (1987-03-01), Bjork et al.
patent: 4653924 (1987-03-01), Itonaga et al.
patent: 4681450 (1987-07-01), Azzam
patent: 4713140 (1987-12-01), Tien
patent: 4815856 (1989-03-01), Bruce
patent: 4826321 (1989-05-01), Coates et al.
patent: 4842410 (1989-06-01), Darrah et al.
patent: 4873430 (1989-10-01), Juliana et al.
patent: 4908508 (1990-03-01), Dubbeldam
patent: 4910549 (1990-03-01), Sugita
patent: 4957368 (1990-09-01), Smith
patent: 4974919 (1990-12-01), Muraki et al.
patent: 4999014 (1991-03-01), Gold et al.
patent: 5042951 (1991-08-01), Gold et al.
patent: 5061072 (1991-10-01), Folkard et al.
patent: 5109430 (1992-04-01), Nishihara et al.
patent: 5120966 (1992-06-01), Kondo
patent: 5159412 (1992-10-01), Willenborg et al.
patent: 5166752 (1992-11-01), Spanier et al.
patent: 5181080 (1993-01-01), Anton et al.
patent: 5274575 (1993-12-01), Abe
patent: 5333052 (1994-07-01), Finarov
patent: 5420680 (1995-05-01), Isobe et al.
patent: 5438209 (1995-08-01), Yamamoto et al.
patent: 5438413 (1995-08-01), Mazor et al.
patent: 5604344 (1997-02-01), Finarov
patent: 5682242 (1997-10-01), Eylon
patent: 5825913 (1998-10-01), Rostami et al.
Ausschnitt, C.P., and Lagus, M.E., "Seeing the forest for the trees: a new approach to CD control," SPIE, vol. 3332, pp. 212-220 (1998).
Equipe Technologies, DBM 2400 Series Dual-Arm Robots for 300mm Wafers-Technical Literature (1 page).
Cybec Systems, Per4Mer 6100 Robot-Technical Literature, Sep. 1998 (1 page).

Affiliated with

Also associated with

Rating

Method and apparatus for alignment of a wafer does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for alignment of a wafer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for alignment of a wafer will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-174915