Method and apparatus for alignment and exposure

Optics: measuring and testing – By alignment in lateral direction – With registration indicia

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Details

250548, 355 53, 355 77, G01B 1100

Patent

active

051501732

ABSTRACT:
An alignment and exposure method usable in manufacture of semiconductor devices, for aligning a mask and a wafer and for exposing the wafer to the mask to print a pattern of the mask on a photoresist of the wafer, is disclosed. The method includes illuminating an alignment mark of the wafer with first illumination light having a center wavelength at a first wavelength and second illumination light having a center wavelength at a second wavelength; adjusting the proportion of the first illumination light and the second illumination light; photoelectrically detecting the alignment mark of the wafer and adjusting the relative position of the wafer to the mask on the basis of a detection signal formed as a result of the photoelectric detection; and exposing the wafer to the mask with exposure light.

REFERENCES:
patent: 4202627 (1980-05-01), Suzki et al.
patent: 4355892 (1982-10-01), Mayer et al.
patent: 4614432 (1986-09-01), Kuniyoshi et al.
patent: 4798962 (1989-01-01), Matsumoto et al.

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