Method and apparatus for aligning the streets of a semiconductor

Details Method and apparatus for aligning the streets of a semiconductor Method and apparatus for aligning the streets of a semiconductor

1977-12-08

1979-09-11

Whitehead, Harold D.

Stone working

Sawing

Rotary

33 1M, 5116572, 125 21, B28D 104

Patent

active

041671740

ABSTRACT:
A method and apparatus for aligning the streets of a semiconductor wafer for sawing or scribing with a single motion control switch. One end of a street is first aligned with a reticle in the Y-direction with this motion control switch. The wafer is then moved in the X-direction while the operator with the same control switch, controls the rotation of the wafer so as to align the street with the reticle. Automatic Y-direction alignment is provided during this rotation by determining the Y-direction misalignment which occurs from the rotation, and by automatically moving the wafer saw blade assembly in the Y-direction to provide the necessary compensation.

REFERENCES:
patent: 2941136 (1960-06-01), Marantette
patent: 3674004 (1972-07-01), Grandia
patent: 3691864 (1972-09-01), Cochran
patent: 3876301 (1975-04-01), Kosugi

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