Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
1998-10-19
2001-01-30
Sells, James (Department: 1734)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C700S121000, C700S192000, C702S153000
Reexamination Certificate
active
06179938
ABSTRACT:
PRIORITY CLAIM
The present application claims priority under 35 U.S.C. § 119 based upon European application no. 97118882.6, filed Oct. 30, 1997.
BACKGROUND OF THE INVENTION
1. Field of the Invention
The invention relates to a bonder, in particular to a die bonder, and to a pick and place machine, and to an apparatus to be used in connection with such a machine which allows a simple alignment of its bonding head.
2. The Background Art
A die bonder is a machine which sticks or bonds a semiconductor chip onto a carrier, specifically a lead frame. In order to ensure that the subsequent wire bonding may take place without any problems, the spatial positioning of the bonding head of the die bonder must be adjusted such that the semiconductor chip bonds onto the carrier in a plane-parallel manner within specified tolerances of approximately 10&mgr;m.
Pick and place machines are well known. They are used, for example, to bond a semiconductor chip onto another semiconductor chip. Such processes are known as flip-chip or C
4
. Pick and place machines are also widely used to place all sorts of electronic components on printed circuit boards.
The object of the invention is to provide means with which the bonding head of a bonder, in particular of a die bonder, or a pick and place machine may be aligned in a simple manner.
BRIEF DESCRIPTION OF THE INVENTION
According to a first embodiment of the invention, a method for aligning the bonding head of a bonder, in particular of a die bonder, or a pick and place machine is provided. An alignment plate provided with two plane parallel surfaces is placed on a supporting surface which extends plane parallel to the bonding surface, upon which the semiconductor chip is to be bonded to the carrier material. A measuring device is calibrated, the signal of the measuring device being dependent upon the position of the alignment plate. The alignment plate is then taken hold of by the bonding head of the bonder and held above the measuring device, preferably by a small distance. Then, the bonding head is positionally aligned until the signal from the measuring device is equal to the signal after the calibration.
In a second embodiment of the present invention, an apparatus for implementing the above method is provided. The alignment plate may have a metalized or ferromagnetic surface.
The measuring device has at least three coils, preferably three or four, arranged in a plane approximately parallel to the supporting surface. A display may be configured to display at least the difference between two of the signals supplied by the three or more coils. Preferably, the apparatus is designed so that, at any one time, only one of said at least three coils produces a significant signal. The apparatus may be configured to allow the coils to be operated in sequence, i.e. with time division multiplexing.
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Gore, et al.; “Fluxing Tool Incorporated Into Part Feeder; Specifically for Assembly of C-5 Chip Carriers”; Motorola, Inc.; Technical Developments, vol. 13; Jul. 1991; pp. 36-37.
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Guenther Thomas
Krieger Matthias
Mannhart Eugen
Ulrich Alois
D'Alessandro & Ritchie
ESEC SA
Koch, III George R.
Sells James
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