Method and apparatus for aligning solder balls

Details Method and apparatus for aligning solder balls Method and apparatus for aligning solder balls

1988-07-26

1989-10-03

Seidel, Richard K.

Metal fusion bonding

Process

Preplacing solid filler

228 41, 269903, 269 21, B23K 306

Patent

active

048711101

ABSTRACT:
Solder balls are supplied onto an aligning plate having aligned through-holes formed therein. Air is sucked from the bottom of the above described aligning plate to fit and attract solder balls into the above described through-holes. Solder balls are thus aligned with high work efficiency.

REFERENCES:
patent: 3320658 (1967-05-01), Bolda et al.
patent: 3355078 (1967-11-01), Smith
patent: 4209893 (1980-07-01), Dyce et al.
patent: 4462534 (1984-07-01), Bittaillou et al.
IBM Technical Disclosure Bulletin, "Release Method For Solder Ball Placement", vol. 30, No. 4, p. 1755, Sep. 1987.

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