Method and apparatus for aligning semiconductor chips using...

Data processing: measuring – calibrating – or testing – Measurement system – Orientation or position

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C700S125000, C033S0010DD, C340S870370, C257S797000, C438S975000

Reexamination Certificate

active

06925411

ABSTRACT:
One embodiment of the present invention provides a system that facilitates measuring an alignment between a first semiconductor die and a second semiconductor die. The system provides a plurality of conductive elements on the first semiconductor die and a plurality of conductive elements on the second semiconductor die. The plurality of conductive elements on the second semiconductor die have a different spacing than the plurality of conductive elements on the first semiconductor die, so that when the plurality of conductive elements on the first semiconductor die overlap the plurality of conductive elements on the second semiconductor die, a vernier alignment structure is created between them. The system also provides a charging mechanism configured to selectively charge each of the plurality of conductive elements on the first semiconductor die, wherein charging a conductive element on the first semiconductor die induces a charge in one or more conductive elements on the second semiconductor die. An amplification mechanism then amplifies the signals induced in the conductive elements on the second semiconductor die. These signals can be analyzed to determine the alignment between the first semiconductor die and the second semiconductor die.

REFERENCES:
patent: 4386459 (1983-06-01), Boulin
patent: 4566193 (1986-01-01), Hackleman et al.
patent: 5198740 (1993-03-01), Jacobsen et al.
patent: 5936411 (1999-08-01), Jacobsen et al.
patent: 5977781 (1999-11-01), Jordil
patent: 6221681 (2001-04-01), Sugasawara
patent: 6518679 (2003-02-01), Lu et al.
patent: 6647311 (2003-11-01), Goff

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method and apparatus for aligning semiconductor chips using... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for aligning semiconductor chips using..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for aligning semiconductor chips using... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3513745

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.