Method and apparatus for aligning patterns on a substrate

Details Method and apparatus for aligning patterns on a substrate Method and apparatus for aligning patterns on a substrate

2007-09-10

2011-10-25

Ahmed, Shamim (Department: 1713)

Coating processes

Measuring, testing, or indicating

C427S256000, C250S492220

Reexamination Certificate

active

08043652

ABSTRACT:
A system and method for aligning prior patterning positions formed by a first SPM tip with a second SPM tip in combination with an SPM system includes identifying first location information that includes a location of the first SPM tip and a sample reference location on an SPM sample and storing the first location information in a storage area. After replacing the first SPM tip with the second SPM tip, second location information, which includes a location of the second SPM tip and the sample reference location on the SPM sample, is identified. Displacement is calculated between the location of the second SPM tip and the first SPM tip based on the first and second location information, and either the second SPM tip or a stage supporting the SPM sample is translated to align the second SPM tip with the location of the first SPM tip in accordance with the calculated displacement.

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