Method and apparatus for aiming a spray etcher nozzle

Details Method and apparatus for aiming a spray etcher nozzle Method and apparatus for aiming a spray etcher nozzle

1998-05-08

1999-11-30

Utech, Benjamin

Etching a substrate: processes

Nongaseous phase etching of substrate

With measuring, testing, or inspecting

216 85, 156345, H01L 21306, B44C 122

Patent

active

059936819

ABSTRACT:
A method and apparatus for achieving alignment between a spray etcher nozzle and a semiconductor (either microelectronic or optoelectronic, for example) wafer surface. A spray nozzle tip is temporarily removed from the spray nozzle and an illumination source, such as a low power laser, is activated and inserted in its place. The laser emission illuminates the wafer surface and, by adjusting the position of the nozzle, alignment between the nozzle and wafer can be achieved. Once aligned, the nozzle is locked in place and the laser is replaced with the conventional spray nozzle tip.

REFERENCES:
patent: 4444495 (1984-04-01), Bramwell et al.
patent: 4532014 (1985-07-01), Polan et al.
patent: 4973379 (1990-11-01), Brock et al.
patent: 5041229 (1991-08-01), Brock et al.
patent: 5127984 (1992-07-01), Hua et al.
patent: 5181985 (1993-01-01), Lampert et al.
patent: 5185056 (1993-02-01), Fuentes et al.
patent: 5874366 (1999-02-01), Sporer et al.

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