Method and apparatus for aiming a spray etcher nozzle

Details Method and apparatus for aiming a spray etcher nozzle Method and apparatus for aiming a spray etcher nozzle

1999-08-03

2000-08-22

Wilczewski, Mary

Semiconductor device manufacturing: process

With measuring or testing

Optical characteristic sensed

438689, H01L 2166

Patent

active

061071102

ABSTRACT:
A method and apparatus for achieving alignment between a spray etcher nozzle and a semiconductor (either microelectronic or optoelectronic, for example) wafer surface. A spray nozzle tip is temporarily removed from the spray nozzle and an illumination source, such as a low power laser, is activated and inserted in its place. The laser emission illuminates the wafer surface and, by adjusting the position of the nozzle, alignment between the nozzle and wafer can be achieved. Once aligned, the nozzle is locked in place and the laser is replaced with the conventional spray nozzle tip.

REFERENCES:
patent: 4444495 (1984-04-01), Bramwell et al.
patent: 5387313 (1995-02-01), Thoms
patent: 5618446 (1997-04-01), Nagaishi
patent: 5972234 (1999-10-01), Weng et al.

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