Method and apparatus for affixing components to a substrate when

Details Method and apparatus for affixing components to a substrate when Method and apparatus for affixing components to a substrate when

1997-08-04

1999-06-29

Graybill, David

Metal working

Barrier layer or semiconductor device making

438 6, 438107, 438118, 438907, H01L 2158, H01L 2168

Patent

active

059165138

ABSTRACT:
An apparatus (400) enclosing a portion of a substrate (401) is used for affixing at least one component to a corresponding circuit of the substrate when a manufacturing line (800) ceases to operate. The apparatus includes a conveyor (400), heating elements (102), and a controller (816) for controlling operation of the apparatus (400). The conveyor is used for indexing the substrate periodically through the apparatus. The heating elements are used for dividing the portion of the substrate enclosed by the apparatus into controllable temperature zones (902). The controller is adapted to cause each of the plurality of heating elements to dynamically adjust the temperature of each of the controllable temperature zones upon the indexing process of the manufacturing line (800) ceasing to operate, until at least one component of each circuit enclosed by the apparatus has been adequately affixed to its corresponding circuit.

REFERENCES:
patent: 4127432 (1978-11-01), Kuwano et al.
patent: 4741787 (1988-05-01), Shimizu et al.
patent: 4941255 (1990-07-01), Bull
patent: 5681757 (1997-10-01), Hayes
patent: 5851852 (1998-12-01), Ostop et al.
patent: 5858806 (1999-01-01), Nishida

Affiliated with

Also associated with

Rating

Method and apparatus for affixing components to a substrate when does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for affixing components to a substrate when, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for affixing components to a substrate when will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1373590