Wave transmission lines and networks – Automatically controlled systems – Impedance matching
Reexamination Certificate
2001-04-06
2004-07-06
Pascal, Robert (Department: 2817)
Wave transmission lines and networks
Automatically controlled systems
Impedance matching
C333S033000
Reexamination Certificate
active
06759917
ABSTRACT:
BACKGROUND OF THE INVENTION
The present invention relates to matching-circuit impedance adjusting method and apparatus for adjusting the impedance of a matching circuit having pattern lines.
Conventionally, for transmitting amplifier circuits in telephone base stations, an average power of, for example, 280 W has been required while it has been required to secure an output of such large power, it has moreover been required to amplify and transmit a signal through high-precision signal conversion that allows signal distortion to be suppressed as much as possible, thereby preventing any adverse effects on other communications. In order to meet such a strict demand, it is necessary to adjust the impedances of chip capacitors
102
,
103
for a multiplicity of transistors
101
used in the transmitting amplifier circuits of a base station by adjusting the constants and placement positions of the chip capacitors
102
,
103
with a soldering iron as shown in FIG.
33
.
In this impedance adjustment, it is required to convert from several ohms to 50 ohms to 1 or 2 ohms as an example. In order that such large output performance can be be ensured, it is necessary, in the impedance adjustment, to perform the adjustment work within a low degree of freedom to achieve the matching of passive components. By way of a concrete example of the adjustment, given that moving the capacitors
102
,
103
by 1 mm causes the center frequency to shift by 30 MHz as an example, the precision requirement, which is in several MHz, demands positional adjustment on the order of the first decimal place, thus making the adjustment work very difficult.
Also, conventional impedance adjustment places result from the combination of 8 parameters consisting of individual positions of two input capacitors and two output capacitors as well as their respective constants. Such mixed adjustment work at plural sites would involve mutual effects among individual processes for the work, resulting in complex adjustment work. Thus, there has been an issue that the conventional adjustment time would be at least 10 minutes or more as an example and, in some cases, several hours.
An example of the method for a adjustment is a cut-and-try process. In this process, for example, first in a coarse adjustment, the best position is adjusted with a capacitor of large capacity (1:5 &rgr;f) to determine the best gain and the best position, the best position is again adjusted and determined with 1.8 of &rgr;f and further with about 2.2 &rgr;f-5 &rgr;f, and then the capacitor is fixedly set in its best condition. Next, in a fine adjustment, with a capacitor of small capacity (0.1 &rgr;f) added for the fine adjustment, the fine adjustment is carried out in the same manner as in the coarse adjustment, the best position is adjusted with 0.2 &rgr;f to determine the best gain and the best position, and the best position is again adjusted and determined with 0.5 &rgr;f. By repeating this process, the capacitor is fixedly set in its best condition. However, since this process is performed by manual work, there have been issues that significant variations would occur among workers and that longer working time would be required.
Accordingly, an object of the present invention is to solve the above-described issues and to provide method and apparatus for adjusting the impedance of a matching circuit by which the impedance adjustment can be achieved in shorter time while ensuring high precision.
SUMMARY OF THE INVENTION
In order to achieve the above object, the present invention has the following constitutions.
According to a first aspect of the present invention, there is provided a matching-circuit impedance adjusting method for adjusting impedance of a matching circuit by, in a matching circuit having a pattern line, partly cutting out a stub protruding widthwise from the pattern line, the method comprising: at occurrence of an excessive cut-out of the stub, forming an auxiliary cut-and-removed portion by partly cutting and removing the stub so that the stub is made apparently longer.
According to a second aspect of the present invention, there is provided a matching-circuit impedance adjusting method according to the first aspect, further comprising:
based on a relationship between cutting-out amounts for partly cutting out the stub of the pattern line and impedances of the matching circuit as well as a relationship between cutting-and-removing amounts of the auxiliary cut-and-removed portion for partly cutting and removing the stub and impedances of the matching circuit, determining a cutting-out amount, or a cutting-and-removing amount, or a cutting-out amount and a cutting-and-removing amount, for adjusting the impedance of the matching circuit to a target value by simulation or by comparison operation of an impedance measured value with information in a database; and
based on the cutting-out amount, or the cutting-out amount and the cutting-and-removing amount, of the stub determined by the simulation or by the comparison operation of the impedance measured value with the information in the database, partly cutting out or cutting and removing the stub, so that the impedance of the matching circuit is adjusted to the target value.
According to a third aspect of the present invention, there is provided a matching-circuit impedance adjusting method according to the first aspect, further comprising: in partly cutting and removing the stub to form the auxiliary cut-and-removed portion, forming a slit along a widthwise direction of the stub.
According to a fourth aspect of the present invention, there is provided a matching-circuit impedance adjusting method according to the third aspect, wherein the slit is formed three or more in number in the stub of the pattern line so that the three or more slits are formed into comb-teeth-like cuts.
According to a fifth aspect of the present invention, there is provided a matching-circuit impedance adjusting method according to the third aspect, wherein the slit is formed three or more in number in the stub of the pattern line so that the three or more slits are formed into staggered cuts.
According to a sixth aspect of the present invention, there is provided a matching-circuit impedance adjusting method according to the first or second aspect, further comprising: in partly cutting and removing the stub of the pattern line to form the auxiliary cut-and-removed portion, forming a cut-out along a widthwise direction of the stub of the pattern line.
According to a seventh aspect of the present invention, there is provided a matching-circuit impedance adjusting method according to the first or second aspect, further comprising: in partly cutting and removing the stub of the pattern line to form the auxiliary cut-and-removed portion, forming a hook-type slit in the stub of the pattern line.
According to an eighth aspect of the present invention, there is provided a matching-circuit impedance adjusting method according to any one of the first through seventh aspects, wherein the cutting-out amount, or the cutting-and-removing amount, or the cutting-out amount and cutting-and-removing amount, of each stub of the pattern line are made different from one another.
According to a ninth aspect of the present invention, there is provided a matching-circuit impedance adjusting method according to any one of the first through eighth aspects, further comprising: changing the cutting-and-removing amount of the auxiliary cut-and-removed portion in a thicknesswise direction of the stub of the pattern line, thereby performing the impedance adjustment.
According to a 10th aspect of the present invention, there is provided a matching-circuit impedance adjusting method according to any one of the first through ninth aspects, wherein the auxiliary cut-and-removed portion is formed by, with a recessed portion previously formed along a thicknesswise direction of the stub of the pattern line, burying an insulating resin in the recessed portion and then cutting and removing the insulating resin to form the auxiliary cut-and-removed p
Ikurumi Kazuhiro
Kajiwara Shoichi
Kumazawa Osamu
Pascal Robert
Takaoka Dean
Wenderoth , Lind & Ponack, L.L.P.
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