Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2011-04-05
2011-04-05
Crispino, Richard (Department: 1747)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S273300
Reexamination Certificate
active
07918963
ABSTRACT:
An apparatus maintaining adjusted positions of parts assembled by adhering includes a device coating plural sections between a part and an adhering target with light energy curable adhesives adhering the part to the adhering target, a light energy irradiating device for curing the adhesive, and a detecting device detecting a displacement of the part from the adhering target. A curing shrinkage force control device is also provided to control the light energy irradiating device to change the light and thus control curing shrinkage forces to offset undesirable stresses generated by the curing shrinkage forces when undesirable displacement is detected.
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Machine Translation of JP 11291539 A, Oct. 14, 2009.
Official action (and English translation thereof) in connection with a counterpart Japanese patent application No. 2002-276294.
Ohshima Hisayoshi
Taneda Yuusuke
Terashi Taroh
Cooper & Dunham LLP
Crispino Richard
McNally Daniel
Ricoh & Company, Ltd.
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