Method and apparatus for adhering a tape or sheet to a semicondu

Details Method and apparatus for adhering a tape or sheet to a semicondu Method and apparatus for adhering a tape or sheet to a semicondu

1986-02-25

1987-12-22

Weston, Caleb

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156286, 156382, B32B 3120

Patent

active

047145110

ABSTRACT:
A method and apparatus for adhering an adhesive-backed tape or sheet to the back surface of a semiconductor wafer having electrical patterns already formed on the front surface thereof. The apparatus comprises a housing forming a vacuum working chamber containing a circular supporting table for the semiconductor wafer and a roller mechanism for exerting pressure on an adhesive-backed tape or sheet having the adhesive surface thereof located above and facing the semiconductor wafer. In the adhering method, the adhesive-backed tape or sheet is first adhered only at the peripheral edges of the semiconductor wafer, and then the central portion of the adhesive-backed tape or sheet is drown against the semiconductor wafer by a change in pressure in the vacuum working chamber. In this method, since an external force is not applied to the front surface of the semiconductor wafer, the electrical patterns thereon will not be damaged during the adhesion of the adhesive-backed tape or sheet to the back surface of the semiconductor wafer.

REFERENCES:
patent: 3330714 (1967-07-01), Gunderson
patent: 4242162 (1980-12-01), Ronwing et al.
patent: 4283242 (1981-08-01), Negler et al.

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