Method and apparatus for adhering a tape or sheet to a semicondu

Details Method and apparatus for adhering a tape or sheet to a semicondu Method and apparatus for adhering a tape or sheet to a semicondu

1987-06-24

1988-11-29

Ball, Michael W.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

100210, 156299, 156312, 156382, 156481, 156555, 156582, B32B 3104

Patent

active

047879513

ABSTRACT:
A method and apparatus for adhering an adhesive-backed tape or sheet to a surface of a semiconductor wafer. The apparatus comprises a housing forming a vacuum working chamber containing a supporting table for the semiconductor wafer and a plurality of rollers for exerting pressure on an adhesive-backed tape or sheet and pressing it against the wafer surface. The rollers comprise rubber rollers having different axial lengths so that, even if the wafer is warped, the tape or sheet can be uniformly adhered to the whole surface of the wafer.

REFERENCES:
patent: 2793676 (1957-05-01), Hubmeier
patent: 2983635 (1961-05-01), Richardson
patent: 3322598 (1967-05-01), Marks et al.
patent: 4026755 (1977-05-01), Gossie
patent: 4327634 (1982-05-01), Colmon et al.

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