Electric heating – Heating devices – Combined with container – enclosure – or support for material...
Reexamination Certificate
2005-09-27
2005-09-27
Gurley, Lynne A. (Department: 2812)
Electric heating
Heating devices
Combined with container, enclosure, or support for material...
C266S252000
Reexamination Certificate
active
06949722
ABSTRACT:
A method and an apparatus utilized for thermal processing of substrates during semiconductor manufacturing. The method includes heating the substrate to a predetermined temperature using a heating assembly, cooling the substrate to the predetermined temperature using a cooling assembly located such that a thermal conductance region is provided between the heating and cooling assemblies, and adjusting a thermal conductance of the thermal conductance region to aid in heating and cooling of the substrate. The apparatus includes a heating assembly, a cooling assembly located such that a thermal conductance region is provided between the heating and cooling assemblies, and a structure or configuration for adjusting a thermal conductance of the thermal conductance region.
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Johnson Wayne L.
Strang Eric J.
Gurley Lynne A.
Oblon & Spivak, McClelland, Maier & Neustadt P.C.
Stevenson Andre′ C.
Tokyo Electron Limited
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