Method and apparatus for achieving reduced component failure dur

Metal fusion bonding – Process – Plural joints

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228 37, 228 42, 228 20, B23K 3102

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active

046485473

ABSTRACT:
Failure of an electronic component (18) during soldering of leads (16--16) thereof to a substrate (12) can be reduced by directing a gas such as air across the top surface (13) of the substrate against the leads. The gas directed against the leads serves to drive off corrosive flux vapors which would otherwise migrate upwardly along the leads causing corrosion thereto and failure of the component.

REFERENCES:
patent: 3605244 (1971-09-01), Osborne et al.
patent: 3705457 (1972-12-01), Tardoskegyi
patent: 3874068 (1975-04-01), Cook
patent: 3924794 (1975-12-01), Allen et al.
patent: 4072777 (1978-02-01), Schoenthaler
patent: 4538757 (1985-09-01), Bertiger

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