Method and apparatus for accurately measuring thickness of a sem

Details Method and apparatus for accurately measuring thickness of a sem Method and apparatus for accurately measuring thickness of a sem

1991-03-04

1992-09-08

Lall, Parshotam S.

Boots, shoes, and leggings

364552, 364476, G01B 506

Patent

active

051464160

ABSTRACT:
A method for measuring die bond material (27) used to bond a semiconductor die (26) to a lead frame (28). The semiconductor die (26) height is measured on the lead frame (28). Die bond material (27) is placed onto the lead frame (28) and the semiconductor die (26) is pressed into the die bond material (27). The height of the semiconductor die (26) on the die bond material (27) is measured again. Thickness of the die bond material (27) is obtained by subtraction of the two heights.

REFERENCES:
patent: 4548066 (1985-10-01), Martinez et al.
patent: 4785731 (1988-11-01), Nguyen

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