Measuring and testing – Specimen stress or strain – or testing by stress or strain... – By loading of specimen
Patent
1995-04-18
1997-06-24
Chilcot, Richard
Measuring and testing
Specimen stress or strain, or testing by stress or strain...
By loading of specimen
73831, G01N 308
Patent
active
056419139
ABSTRACT:
A tensile strength or pull strength testing of a semiconductor bump electrode is measured without mounting a semiconductor chip on a substrate or the like. A probe to be inserted into a semiconductor bump electrode is heated up to a temperature at which a metal of the bump electrode 21 is fused, and then the probe having been heated up to the temperature to fuse the metal of the bump electrode is inserted into the bump electrode so that the metal of the bump electrode is fused. Further, the fused metal of the bump electrode is cooled down together with the probe to solidify the same. Thereafter, the probe fixed within the bump electrode is pulled vertically relative to the bump electrode until the bump electrode breaks. At the time of breakage of the semiconductor bump electrode, the pull force is detected as the pull strength of the bump electrode.
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Chilcot Richard
Nippondenso Co. Ltd.
Noori Max H.
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